dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• Our process training would cover variety of topics from choosing the right blades to setting an appropriate dicing process for various materials and applications.
  我们的工艺培训可以涵盖不同的主题，包括面对不同材料和应用该如何选择合适的刀片到设置适当的工艺参数等。
• Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
  基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
• Development of Conductive Photopolymer Resin Bond Dicing Blade
  导电性光固化树脂结合剂锯片的研制
• In OLAP processing, slicing and dicing is often performed along a time axis to analyze trends and find time-based patterns in the data.
  在OLAP的加工，切片和切割往往是演出沿着时间轴来分析发展趋势，并抽出时间为基础的模式中的数据。
• You're dicing with death by driving that car so fast.
  你把车开得那么快简直在找死。
• The secondary advantages can include a significant reduction of labor costs, as no post visual inspection is needed as in traditional dicing processes.
  第二大优点包括，降低了人工费用，不需要常规的后续视觉检测。
• Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
  通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
• Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
  砂轮划片机θ向机构和传动误差分析