soldering

英 [ˈsəʊldəɪŋ]

美 [ˈsɑːdərɪŋ]

v.  焊接; 焊合
solder的现在分词

现在分词：soldering　

计算机化学

BNC.46499 / COCA.35943

柯林斯词典

• VERB 焊;焊接;焊合
  If yousoldertwo pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so that it holds them together after it has cooled.
  1. Fewer workers are needed to solder circuit boards...
     焊接电路板需要的工人更少了。
  2. He then soldered the wire to the telephone terminal...
     接着他把电话线焊接到电话机上。
  3. He cuts the pieces and solders them together.
     他把那些断片切碎，然后把它们焊在一起。
• 焊料;焊锡
  Solderis the soft metal used for soldering.

英英释义

noun

• fastening firmly together
  Synonym:bonding

双语例句

• Works of this category mainly involve two types of material, i.e.ceramics and soldering iron.
  这类作品，主要是陶瓷和焊铁两种材料。
• This article introduces the furnace stability that is subject to two key parameters: soldering temperature and heat preservation.
  介绍了窑炉工作的稳定性主要由烧结温度和保温时间两个重要参数决定。
• The soldering qualities of radiating fin are increased by adding Mg spalls in vacuo soldering furnace.
  通过跟踪试验，在真空钎焊炉内加入镁屑，解决了质量问题，提高了散热片的钎焊成品率。
• Resistance diffusing soldering of copper and mild steel Static contact Electrode shape Inserting solder Potential difference;
  铜与低碳钢电阻扩散焊；静触头；电极形状；嵌料；电位差；
• The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
  导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
• Flying leads point-to-point soldering to switches, connectors and transformers;
  飞行导致点对点焊接到开关，连接器和变压器；
• Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
  本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
• Apply to the high-grade circuit boards wave soldering, welding and hot dip high-grade iron tin wire.
  适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。
• Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
  通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；
• It involves the considerations of alloy content, tin powder particle and soldering flux type.
  选择锡膏要考虑的因素包括合金含量，锡粉颗粒和助焊剂的因型。